Power interconnect integrity detection
US8730632B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2012 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Jan 29, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/3058
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments include systems and methods for detecting and/or responding to deficiencies in power interconnect integrity. For example, a first module distributes power to a second module via a high-current mechanical power interconnect. Insufficient integrity in the interconnect can manifest as an impedance, causing potential thermal hazards. A separate (e.g., low-current) interconnect is used to monitor the power being received by the second module from the first module. Embodiments detect when a difference between the power supplied to and received by the second module exceeds a threshold difference, which can indicate deficient interconnect integrity (i.e., a fault). The supply of high-current power to the second module can be substantially immediately interrupted upon detecting the fault.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.