Electronic device and method of radiating heat from electronic device
US8730675B2 · kind B2 · utility
6Cited by
3References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 24, 2012 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Jul 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0202
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device including a housing including a frame member exposed to an outer surface of the electronic device; a circuit substrate disposed within the housing on which a plurality of electronic components are disposed; and a heat-radiating member provided in contact with or in close proximity to the electronic components disposed on the circuit substrate, and in contact with the frame member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.