Patent · US Active

Method of cooling electronic circuit boards using surface mounted devices

US8730677B2 · kind B2 · utility

2Cited by

13References

9Claims

0Family size

Assignee

ADVA Optical Networking SE · DE

Inventors

Toni Wald · Kaltennordheim, DE
Sven Liborius · Suhl, DE

Key dates

Filing date	Dec 13, 2011
Grant date	May 20, 2014
Priority date	—
Expiry date	Jul 26, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.