MEMS microphone
US8731220B2 · kind B2 · utility
5Cited by
6References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 14, 2011 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Dec 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS microphone includes a silicon substrate, a diaphragm connected to the silicon substrate, a backplate opposed from the diaphragm for forming an air gap. The backplate defines a plurality of first through holes and a plurality of second through holes surrounded by the first through holes, each of the first through holes being formed by a straight boundary and an arc boundary, the radius of the second boundary being greater than half the width of the first boundary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.