Method of packaging a sensor

US8732938B2 · kind B2 · utility

Assignees

• MEAS France · FR
• Hella KGaA Hueck & Co. · DE

Inventors

• Oleg Kolosov · San Jose, US
• Leonid Matsiev · San Jose, US
• John F. Varni · Campbell, US
• G. Cameron Dales · Saratoga, US
• Olaf Lüdtke · Hambergen, DE
• Dirk Wullner · Lippstadt, DE
• Andreas Buhrdorf · Bremen, DE
• Heiko Dobrinski · Bremen, DE

Key dates

• Filing date: May 19, 2010
• Grant date: May 27, 2014
• Expiry date: Mar 27, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4908
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.