MEMS stress concentrating structure for MEMS sensors
US8733176B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 1, 2010 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Apr 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stress concentrating apparatus and a method for a MicroElectroMechanical System (MEMS) sensors is provided. The apparatus includes a plate having an inner region and outer region, the inner region being separated from the outer region by slits defined in the plate. A stress concentrator bridge connects the inner region to the outer region, and to mechanically amplify stress applied on the inner region of the plate. At least one stress sensor is operatively connected to the stress concentrator bridge, whereby the at least one stress sensor converts the mechanically amplified stress applied on the inner region into an electrical signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.