Thermal inkjet print head with solvent resistance
US8733900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2013 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | May 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of preparing an inkjet printing system with a print head in fluid communication with an ink reservoir and having a plurality of orifices and a corresponding plurality of associated ejection chambers includes providing a substrate and disposing a photoresist material on the substrate. A mask is provided between the UV light source and the photoresist material. The photoresist material is exposed to the UV light source to polymerize the photoresist material to form a barrier layer on the substrate. The barrier layer defines in part a plurality of fluid channels and the plurality of ejection chambers. An orifice plate is attached over the substrate. The orifice plate includes a plurality of orifices in fluid communication with the ejection chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.