Methods of manufacturing high-strength large-area sputtering targets
US8734896B2 · kind B2 · utility
9Cited by
155References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2012 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Oct 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A joined sputtering target comprising a sputtering material is formed by disposing two discrete sputtering-target tiles comprising the sputtering material proximate each other, thereby forming an interface between the tiles, the interface comprising at least one of an interlocking joint therein or a recess in a top surface thereof, and spray-depositing a spray material over at least a portion of the interface, thereby joining the tiles to form the joined sputtering target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.