Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds
US8734939B2 · kind B2 · utility
23Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Dec 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.