Apparatus for atomic layer deposition with sloped purge injection nozzle structure
US8735188B2 · kind B2 · utility
1Cited by
0References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2012 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jan 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/844
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An atomic layer deposition apparatus and a sealing method of an organic light emitting device using the same are disclosed. In one embodiment, the atomic layer deposition apparatus improves a structure of the purge gas injection nozzle so as to increase the exhaust efficiency of the purge gas in an atomic layer deposition process, which increases a speed of a purge process. As a result, it is possible to improve a deposition speed and a quality of a sealing film when a sealing process for sealing the organic light emitting device is implemented by using the atomic layer deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.