Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
US8735199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2013 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jan 24, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0194
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In an embodiment a method of fabricating a MEMS structure is provided. The method includes fabricating a working structure in a doped layer proximate a first surface of a silicon substrate. The first surface of the silicon substrate is bonded to a first planar glass structure having a first one or more sacrificial features embedded therein. The method also includes etching to remove a bulk of the silicon substrate, wherein the bulk is reverse of the first surface on the silicon substrate, wherein etching removes the bulk and leaves the working structure bonded to the first planar glass structure. The method also includes etching to remove the first one or more sacrificial features from the first planar glass structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.