Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus

US8735218B2 · kind B2 · utility

Assignee

• Muehlbauer AG · DE

Inventors

• Michael Mueller · Nagold, DE
• Helfried Zabel · Dresden, DE
• Hans-Peter Monser · Dresden, DE

Key dates

• Filing date: Dec 1, 2009
• Grant date: May 27, 2014
• Expiry date: Jun 29, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1744
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.