Method and apparatus for optically transparent via filling
US8735740B2 · kind B2 · utility
4Cited by
59References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Mar 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.