Molded microwave field director structure
US8735785B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 10, 2008 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Feb 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/704
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A reusable self-supporting field director structure for use in heating an article in a microwave oven is characterized by an integral array of rigid vanes extending radially outwardly from a central axis, the vanes being molded from an electrically non-conductive heat-resistant material. At least a portion of one major surface of each vane has an electrically conductive material embedded thereinto. The electrically non-conductive heat-resistant material is either a polymeric resin (with an optional reinforcing matrix) or paperboard material. A plurality of bracing members, each extending between the first major surface of one vane and the second major surface of an adjacent vane, may be integrally molded into the field director structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.