Light emitting diode package and fabrication method thereof
US8735931B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2010 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Oct 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
Abstract
An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.