Method of generating a hole or recess or well in a substrate
US8736026B2 · kind B2 · utility
3Cited by
11References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2010 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Mar 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.