Semiconductor device and method for making same
US8736072B2 · kind B2 · utility
1Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jan 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.