Sensor array package
US8736080B2 · kind B2 · utility
9Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2012 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Sep 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.