Electronic device housing and manufacturing method thereof
US8737045B2 · kind B2 · utility
12Cited by
1References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 11, 2010 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jul 13, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing to form a receiving groove between the bottom housing and the plastic side frame. The plastic side frame is integrally formed by injecting a plastic material in the receiving groove. A manufacturing method for an electronic device housing is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.