Heat dissipation system
US8737070B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 1, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jun 18, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.