Heat dissipation device
US8737071B2 · kind B2 · utility
22Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Oct 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube. The heat-sink base includes a heat absorption area configured to absorb heat. A cooling fluid, received in the heat-sink base, may be vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.