Systems and methods providing thermal spreading for an LED module
US8737073B2 · kind B2 · utility
5Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Apr 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.