Cast grid array (CGA) package and socket
US8739392B2 · kind B2 · utility
4Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2009 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Jun 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.