Method of manufacture of IC contactless communication devices
US8739402B2 · kind B2 · utility
5Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2008 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Dec 31, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an electrical bridge including the following steps: (a) providing a first flexible electrically insulating material, (b) laminating a pattern of a second electrically conductive material, on the first material, (c) separating a strap having a connection portion formed from the pattern of electrically conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.