Integrated thermal module and back plate structure and related methods
US8739478B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Sep 30, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An integrated solar module capable of being easily assembled for thermal solar application. The module includes a solar panel device having an aperture region and a backside region and a shaped thickness of material including a first side wall and a second side wall. The shaped thickness of material is characterized by a fire rating of at least A and has a mechanical strength to maintain a thickness free from penetration of moisture and a specific shape to couple with the backside region. Additionally, the module includes an air plenum provided between the backside region and the shaped thickness of material. The air plenum is configured to receive air flows from ambient via an intake region and guide the air flows toward an output region. The air flows are optionally let to pass through either or both of the first side wall and the second side wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.