Solder injection head
US8740040B2 · kind B2 · utility
13Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2012 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Oct 30, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0623
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.