Handling layer and adhesive parts formed therewith
US8741094B2 · kind B2 · utility
0Cited by
41References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2012 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Jan 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1043
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A handling layer and adhesive parts having the handling layer are formed according to the present invention along with used therefore.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.