Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US8741998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2012 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Feb 22, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/013
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 107 Ohm·cm. Also disclosed are articles and methods of use therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.