Housing assembly to enclose and ground an electrical subassembly
US8742255B2 · kind B2 · utility
7Cited by
21References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2011 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Jun 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A housing assembly to enclose an electrical subassembly includes a housing formed from a conductive polymer. The housing has a cavity sized to receive an electronic sub-assembly therein. A conductive boss is insert-molded into the housing in conductive contact with the housing. A conductive bracket is fastened to the boss in conductive connection with the boss and the housing to support and electrically ground the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.