Ultrasound acoustic assemblies and methods of manufacture

US8742646B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Robert Gideon Wodnicki · Schenectady, US
• Charles Edward Baumgartner · Niskayuna, US
• David Martin Mills · Niskayuna, US
• Kevin Matthew Durocher · Cohoes, US
• William Hullinger Huber · Scotia, US
• George Charles Sogoian · Glenville, US
• Christopher James Kapusta · Duanesburg, US

Key dates

• Filing date: Mar 29, 2012
• Grant date: Jun 3, 2014
• Expiry date: Jul 10, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/42
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.