Process for fabricating an ultra-low-resistance superconducting joint having high shielding characteristics
US8745851B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Sep 7, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49201
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for fabricating an ultra-low-resistance superconducting joint that has high shielding characteristics. The process includes: corroding copper on the outer surface at the end of a NbTi/Cu superconducting wire to form terminal NbTi superconducting filaments; inserting same number of NbTi superconducting filaments into each through hole of the niobium layer of a Nb/NbTi/Cu multilayer composite rod; pressing at the outside of the Nb/NbTi/Cu multilayer composite rod to combine the Nb/NbTi/Cu multilayer composite rod and NbTi superconducting filaments together to form a joint; and inserting the joint into a YBCO tube, and then filling the YBCO tube with molten bismuth-lead-tin-cadmium (BiPbSnCd) alloy solder to form a superconducting joint with high shielding and low resistance characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.