Patent · US Active

Method for applying soft solder to a mounting surface of a component

US8745858B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

JEONPTIK Laser GmbH · DE

Inventors

Dominic Schroeder · Lütjenburg, DE
Matthias Schroeder · Badendorf, DE

Key dates

Filing date	Feb 22, 2011
Grant date	Jun 10, 2014
Priority date	—
Expiry date	Feb 22, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53174
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.