Patent · US Active

Process for heat integration by means of a refrigeration system

US8745995B2 · kind B2 · utility

0Cited by

5References

16Claims

0Family size

Assignee

BASF SE

Inventors

Gerhard Theis · Frankenthal (Pfalz), DE
Thomas Borren · Shanghai, CN
Jörg Schlecht · Gerolsheim, DE
Frans Vansant · Kalmthout, BE

Key dates

Filing date	Oct 7, 2011
Grant date	Jun 10, 2014
Priority date	—
Expiry date	Mar 20, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02A30/274
WIPO fieldThermal processes and apparatus
WIPO sectorMechanical engineering

Abstract

A process for heat integration in engineering processes is provided in which, in a heat carrier circuit, a heat carrier medium takes up heat from a first process stream in a first heat exchanger and releases it to a refrigeration system. In a refrigerant circuit, a refrigerant is cooled in the refrigeration system and the refrigerant takes up heat from a second process stream in a second heat exchanger or a second process stream is cooled in the refrigeration system. The first process stream is a vapor stream from a thermal separation apparatus, and the temperature of the heat carrier medium is increased by heat supply between egress from the first heat exchanger and ingress into the refrigeration system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.