Multilayer molding apparatus and injection molding method
US8747094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2012 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Nov 21, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/0441
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A multilayer molding apparatus, comprising: a fixed platen; a movable platen; an intermediate platen positioned between the fixed platen and the movable platen to be movable in the direction to come close or be opened, and having a surface facing the fixed platen, a surface facing the movable platen, and a housing space that goes therethrough from the surface facing the fixed platen to the surface facing the movable platen; and a rotary platen rotatably supported by the intermediate platen inside the housing space of the intermediate platen, and having at least one pair of parallel surfaces facing the fixed platen and the movable platen, wherein at least one of the surfaces of the intermediate platen facing the fixed platen and the movable platen is a mold mounting surface on which a mold can be mounted directly or indirectly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.