Method for manufacturing insert-molded cover
US8747719B2 · kind B2 · utility
1Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2011 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Sep 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.