Process for prolonging the processing window of thermosetting resins
US8747720B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 14, 2009 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Feb 11, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2063/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The processing window for thermosetting resins that contain particulate hardeners is prolonged using the combined steps of heat-treating the resin to form a low-viscosity resin mixture in which the particles are dissolved and then molding the low-viscosity resin mixture at temperatures below the dissolution temperature of the particles to infuse a fibrous preform. The infused resin preform is heated to the curing temperature of the resin to provide final curing of the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.