Use of photosensitized Epon epoxy resin 1002F for MEMS and bioMEMS applications

US8748085B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Jeng-Hao Pai · Chapel Hill, US
• Yuli Wang · Lynnwood, US
• Christopher Sims · Irvine, US
• Mark Bachman · Irvine, US
• Nancy Allbritton · Irvine, US
• Guann-Pyng Li · Irvine, US

Key dates

• Filing date: Jul 25, 2008
• Grant date: Jun 10, 2014
• Expiry date: Aug 24, 2029

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/0037
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.