Epoxy resin composition, and prepreg and printed circuit board using the same
US8748513B2 · kind B2 · utility
4Cited by
2References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 2010 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Jun 25, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.