Printed board assembly interface structures
US8748750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2011 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Nov 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.