Electronic component, electronic device, and method of manufacturing the electronic component
US8749001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2011 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Feb 4, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/5783
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic component includes: a semiconductor element including a circuit; a vibration element; a first electrode arranged on a first surface of the semiconductor element and connected to the circuit and the vibration element arranged on the first surface side; a second electrode arranged on the first surface; a first wiring board including a first wire connected to the second electrode; and a second wiring board including a second wire to which the first wire is connected. At least a part of an inner side region of an outer contour of the vibration element is arranged to overlap the second electrode in plan view facing the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.