Electronic device
US8749052B2 · kind B2 · utility
8Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2010 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Jul 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electric device with an insulating substrate consisting of an insulating layer and at least one metallization on a surface side of the insulating layer, the metallization being structured and having an electric component on the metallization. The metallization has a layer thickness that is stepped and is greater in an area adjoining the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.