Method and system for measuring the thickness of an object
US8749230B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2010 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Mar 22, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems are provided for measuring a thickness of an object. A first portion of a device is positioned on a first side of the object, and a second portion of the device is positioned on an opposite side of the object. The first portion includes at least one first mount and at least one eddy current sensor coupled to the first mount. The second portion includes at least one second mount and at least one target coupled to the second mount. The first mount is magnetically coupled to the second mount such that the eddy current sensor is oriented to interact with the target to enable the thickness of the object to be measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.