Integrated optical interconnect
US8750660B2 · kind B2 · utility
8Cited by
28References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2012 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Aug 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for fabricating an integrated optical interconnect includes disposing a layer over a substrate on which at least one optoelectronic transducer has been formed. A groove is formed in the layer in alignment with the optoelectronic transducer. A slanted mirror is formed in the layer at an end of the groove adjacent to the optoelectronic transducer to direct light between the optoelectronic transducer and an optical fiber placed in the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.