Patent · US Active

Micromechanical acceleration sensor

US8752430B2 · kind B2 · utility

4Cited by

17References

16Claims

0Family size

Assignee

Continental Teves AG & Co. OHG · DE

Inventors

Roland Burghardt · Frankfurt am Main, DE
Roland Hilser · Kirchheim unter Teck, DE
Bernhard Schmid · Friedberg, DE
Veith Albrecht · Heusenstamm, DE
Dirk Theobald · Eschborn, DE

Key dates

Filing date	Apr 3, 2009
Grant date	Jun 17, 2014
Priority date	—
Expiry date	Nov 29, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49124
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical acceleration sensor, including at least one substrate, one or more frames, at least a first frame of which is suspended directly or indirectly on the substrate by at least one spring element, and is deflected with respect to the substrate when at least a first acceleration acts, and at least a first seismic mass which is suspended on the first frame or an additional frame by at least one spring element, and is deflected with respect to this frame when an acceleration acts which is, in particular, different from the first acceleration.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.