Jetting dispenser and method of jetting highly cohesive adhesives
US8753713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2011 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Nov 16, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/1034
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Jetting dispensers and methods of non-contact dispensing a hot melt adhesive onto a substrate. The method may include jetting a plurality of droplets of the hot melt adhesive from a nozzle outlet toward the substrate in a direction of travel. Each droplet has a droplet length approximately aligned with the direction of travel and a droplet width shorter than the droplet length. The jetting is controlled such that each of the droplets does not collapse into a spherical-shaped droplet during flight from the nozzle outlet to the substrate. The nozzle outlet may be heated to a first temperature, and the method may further include rapidly heating each droplet of the hot melt adhesive to a second temperature higher than the first temperature upon release from the nozzle outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.