Light emitting device package
US8754423B2 · kind B2 · utility
6Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2013 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.