Image sensing device including through vias electrically connecting imaging lens unit to image sensors
US8754494B2 · kind B2 · utility
4Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2011 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Jan 26, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13
Abstract
According to one embodiment, a solid-state image sensing device includes a semiconductor substrate on which a plurality of pixels are arranged, a transparent substrate including a first through via provided in an opening formed in advance to extend through, an adhesive including a second through via connected to the first through via and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels, and an imaging lens unit arranged on the transparent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.