Surface-mounted electronic component
US8754523B2 · kind B2 · utility
1Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2011 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Mar 13, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface-mounted electronic component including balls bonded to its front surface and, on the front surface, a protective resin layer having a thickness smaller than the ball height, wherein grooves extend in the resin layer between balls of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.