Modular array and circuits for ultrasound transducers
US8754574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2011 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Apr 15, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.