Multilayer ceramic substrate and method for producing the same
US8754742B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2012 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Sep 26, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/167
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.